„Minus Pad 8“ 30×30×0,5 mm

The Minus Pad 8 is a thermal interface material with dimensions of 30 by 30 millimeters and a thickness of 0.5 millimeters. This product is used to facilitate heat transfer between electronic components and heat sinks or other cooling devices.

The size of 30×30 mm indicates the surface area of the pad, which determines the coverage area for heat dissipation. The thickness of 0.5 mm affects the thermal resistance and mechanical compliance of the pad, influencing how well it fills gaps between surfaces.

• Dimensions: 30×30 mm
• Thickness: 0.5 mm